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+# SPDX-License-Identifier: (GPL-2.0 OR MIT)
+# Copyright 2020 Linaro Ltd.
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/thermal-zones.yaml#
+$schema: http://devicetree.org/meta-schemas/base.yaml#
+
+title: Thermal zone binding
+
+maintainers:
+ - Amit Kucheria <amitk@kernel.org>
+
+description: |
+ Thermal management is achieved in devicetree by describing the sensor hardware
+ and the software abstraction of cooling devices and thermal zones required to
+ take appropriate action to mitigate thermal overloads.
+
+ The following node types are used to completely describe a thermal management
+ system in devicetree:
+ - thermal-sensor: device that measures temperature, has SoC-specific bindings
+ - cooling-device: device used to dissipate heat either passively or artively
+ - thermal-zones: a container of the following node types used to describe all
+ thermal data for the platform
+
+ This binding describes the thermal-zones.
+
+ The polling-delay properties of a thermal-zone are bound to the maximum dT/dt
+ (temperature derivative over time) in two situations for a thermal zone:
+ 1. when passive cooling is activated (polling-delay-passive)
+ 2. when the zone just needs to be monitored (polling-delay) or when
+ active cooling is activated.
+
+ The maximum dT/dt is highly bound to hardware power consumption and
+ dissipation capability. The delays should be chosen to account for said
+ max dT/dt, such that a device does not cross several trip boundaries
+ unexpectedly between polls. Choosing the right polling delays shall avoid
+ having the device in temperature ranges that may damage the silicon structures
+ and reduce silicon lifetime.
+
+properties:
+ thermal-zones:
+ type: object
+ description:
+ A /thermal-zones node is required in order to use the thermal framework to
+ manage input from the various thermal zones in the system in order to
+ mitigate thermal overload conditions. It does not represent a real device
+ in the system, but acts as a container to link thermal sensor devices,
+ platform-data regarding temperature thresholds and the mitigation actions
+ to take when the temperature crosses those thresholds.
+
+ properties:
+ $nodename:
+ pattern: "^[a-zA-Z][a-zA-Z0-9,\\-]{1,12}-thermal$"
+ type: object
+ description:
+ Each thermal zone node contains information about how frequently it
+ must be checked, the sensor responsible for reporting temperature for
+ this zone, one sub-node containing the various trip points for this
+ zone and one sub-node containing all the zone cooling-maps.
+
+ properties:
+ polling-delay:
+ $ref: /schemas/types.yaml#/definitions/uint32
+ minimum: 0
+ description:
+ The maximum number of milliseconds to wait between polls when
+ checking this thermal zone. Setting this to 0 disables the polling
+ timers setup by the thermal framework and assumes that the thermal
+ sensors in this zone support interrupts.
+
+ polling-delay-passive:
+ $ref: /schemas/types.yaml#/definitions/uint32
+ minimum: 0
+ description:
+ The maximum number of milliseconds to wait between polls when
+ checking this thermal zone while doing passive cooling. Setting
+ this to 0 disables the polling timers setup by the thermal
+ framework and assumes that the thermal sensors in this zone
+ support interrupts.
+
+ thermal-sensors:
+ $ref: /schemas/types.yaml#/definitions/phandle-array
+ description:
+ A list of thermal sensor phandles and sensor specifiers used to
+ monitor this thermal zone.
+
+ trips:
+ type: object
+ description:
+ This node describes a set of points in the temperature domain at
+ which the thermal framework needs to takes action. The actions to
+ be taken are defined in another node called cooling-maps.
+
+ patternProperties:
+ "^[a-zA-Z][a-zA-Z0-9,+\\._]{0,63}$":
+ type: object
+
+ properties:
+ temperature:
+ $ref: /schemas/types.yaml#/definitions/int32
+ description:
+ An integer expressing the trip temperature in millicelsius.
+
+ hysteresis:
+ $ref: /schemas/types.yaml#/definitions/uint32
+ description:
+ An unsigned integer expressing the hysteresis delta with
+ respect to the trip temperature property above, also in
+ millicelsius.
+
+ type:
+ oneOf:
+ - items:
+ - enum:
+ - active
+ - passive
+ - hot
+ - critical
+ description: |
+ There are four valid trip types,
+ - active - enable active cooling e.g. fans
+ - passive - enable passive cooling e.g. throttling cpu
+ - hot - send notification to driver if .notify
+ callback registered
+ - critical - send notification to driver if .notify
+ callback registered and trigger a shutdown
+
+ required:
+ - temperature
+ - hysteresis
+ - type
+
+ cooling-maps:
+ type: object
+ description:
+ This node describes the action to be taken when a thermal zone
+ crosses one of the temperature thresholds described in the trips
+ node. The action takes the form of a mapping relation between a
+ trip and the target cooling device state.
+
+ patternProperties:
+ "^map[0-9][-a-zA-Z0-9]*$":
+ type: object
+
+ properties:
+ trip:
+ $ref: /schemas/types.yaml#/definitions/phandle
+ description:
+ A phandle of a trip point node within this thermal zone.
+
+ cooling-device:
+ $ref: /schemas/types.yaml#/definitions/phandle-array
+ description:
+ A list of cooling device phandles along with the minimum
+ and maximum cooling state specifiers for each cooling
+ device. Using the THERMAL_NO_LIMIT (-1UL) constant in the
+ cooling-device phandle limit specifier lets the framework
+ use the minimum and maximum cooling state for that cooling
+ device automatically.
+
+ contribution:
+ $ref: /schemas/types.yaml#/definitions/uint32
+ minimum: 0
+ maximum: 100
+ description:
+ The contribution of the cooling devices at the trip
+ temperature, both referenced in this map, to this thermal
+ zone as a percentage.
+
+ required:
+ - trip
+ - cooling-device
+
+examples:
+ - |
+ #include <dt-bindings/interrupt-controller/arm-gic.h>
+ #include <dt-bindings/thermal/thermal.h>
+
+ // Example 1: SDM845 TSENS
+ soc: soc@0 {
+ #address-cells = <2>;
+ #size-cells = <2>;
+
+ /* ... */
+
+ tsens0: thermal-sensor@c263000 {
+ compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
+ reg = <0 0x0c263000 0 0x1ff>, /* TM */
+ <0 0x0c222000 0 0x1ff>; /* SROT */
+ #qcom,sensors = <13>;
+ interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>;
+ interrupt-names = "uplow";
+ #thermal-sensor-cells = <1>;
+ };
+
+ tsens1: thermal-sensor@c265000 {
+ compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
+ reg = <0 0x0c265000 0 0x1ff>, /* TM */
+ <0 0x0c223000 0 0x1ff>; /* SROT */
+ #qcom,sensors = <8>;
+ interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>;
+ interrupt-names = "uplow";
+ #thermal-sensor-cells = <1>;
+ };
+ };
+
+ /* ... */
+
+ thermal-zones {
+ cpu0-thermal {
+ polling-delay-passive = <250>;
+ polling-delay = <1000>;
+
+ thermal-sensors = <&tsens0 1>;
+
+ trips {
+ cpu0_alert0: trip-point0 {
+ temperature = <90000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ cpu0_alert1: trip-point1 {
+ temperature = <95000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ cpu0_crit: cpu_crit {
+ temperature = <110000>;
+ hysteresis = <1000>;
+ type = "critical";
+ };
+ };
+
+ cooling-maps {
+ map0 {
+ trip = <&cpu0_alert0>;
+ cooling-device = <&CPU0 THERMAL_NO_LIMIT
+ THERMAL_NO_LIMIT>,
+ <&CPU1 THERMAL_NO_LIMIT
+ THERMAL_NO_LIMIT>,
+ <&CPU2 THERMAL_NO_LIMIT
+ THERMAL_NO_LIMIT>,
+ <&CPU3 THERMAL_NO_LIMIT
+ THERMAL_NO_LIMIT>;
+ };
+
+ map1 {
+ trip = <&cpu0_alert1>;
+ cooling-device = <&CPU0 THERMAL_NO_LIMIT
+ THERMAL_NO_LIMIT>,
+ <&CPU1 THERMAL_NO_LIMIT
+ THERMAL_NO_LIMIT>,
+ <&CPU2 THERMAL_NO_LIMIT
+ THERMAL_NO_LIMIT>,
+ <&CPU3 THERMAL_NO_LIMIT
+ THERMAL_NO_LIMIT>;
+ };
+ };
+ };
+
+ /* ... */
+
+ cluster0-thermal {
+ polling-delay-passive = <250>;
+ polling-delay = <1000>;
+
+ thermal-sensors = <&tsens0 5>;
+
+ trips {
+ cluster0_alert0: trip-point0 {
+ temperature = <90000>;
+ hysteresis = <2000>;
+ type = "hot";
+ };
+ cluster0_crit: cluster0_crit {
+ temperature = <110000>;
+ hysteresis = <2000>;
+ type = "critical";
+ };
+ };
+ };
+
+ /* ... */
+
+ gpu-thermal-top {
+ polling-delay-passive = <250>;
+ polling-delay = <1000>;
+
+ thermal-sensors = <&tsens0 11>;
+
+ trips {
+ gpu1_alert0: trip-point0 {
+ temperature = <90000>;
+ hysteresis = <2000>;
+ type = "hot";
+ };
+ };
+ };
+ };
+...
As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The thermal-zone binding is a software abstraction to capture the properties of each zone - how often they should be checked, the temperature thresholds (trips) at which mitigation actions need to be taken and the level of mitigation needed at those thresholds. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> --- .../bindings/thermal/thermal-zones.yaml | 302 ++++++++++++++++++ 1 file changed, 302 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml