@@ -41,6 +41,7 @@
*/
#include "sunxi-h3-h5.dtsi"
+#include <dt-bindings/thermal/thermal.h>
/ {
cpu0_opp_table: opp_table0 {
@@ -227,6 +228,30 @@ cpu_thermal: cpu-thermal {
polling-delay-passive = <0>;
polling-delay = <0>;
thermal-sensors = <&ths 0>;
+
+ trips {
+ cpu_hot_trip: cpu-hot {
+ temperature = <80000>;
+ hysteresis = <2000>;
+ type = "passive";
+ };
+
+ cpu_very_hot_trip: cpu-very-hot {
+ temperature = <100000>;
+ hysteresis = <0>;
+ type = "critical";
+ };
+ };
+
+ cooling-maps {
+ cpu-hot-limit {
+ trip = <&cpu_hot_trip>;
+ cooling-device = <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
+ <&cpu1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
+ <&cpu2 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
+ <&cpu3 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+ };
+ };
};
};
};
This enables passive cooling by down-regulating CPU voltage and frequency. For trip points, I used a slightly lowered values from the BSP code. The critical temperature of 110°C from BSP code seemed like a lot, so I rounded it off to 100°C. The critical trip point value is 30°C above the maximum recommended ambient temperature (70°C) for the SoC from the datasheet, so there's some headroom even at such a high ambient temperature. Signed-off-by: Ondrej Jirman <megous@megous.com> --- arch/arm/boot/dts/sun8i-h3.dtsi | 25 +++++++++++++++++++++++++ 1 file changed, 25 insertions(+) v2: - added more detail to the commit description