[-next] thermal: thermal_of: Correct struct name __thermal_bind_params

Message ID 20210518131408.1310057-1-yangyingliang@huawei.com
State New
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  • [-next] thermal: thermal_of: Correct struct name __thermal_bind_params
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Commit Message

Yang Yingliang May 18, 2021, 1:14 p.m.
Fix the following make W=1 kernel build warning:

   drivers/thermal/thermal_of.c:50: warning: expecting prototype for struct __thermal_bind_param. Prototype was for struct __thermal_bind_params instead

Signed-off-by: Yang Yingliang <yangyingliang@huawei.com>
---
 drivers/thermal/thermal_of.c | 2 +-
 1 file changed, 1 insertion(+), 1 deletion(-)

Patch

diff --git a/drivers/thermal/thermal_of.c b/drivers/thermal/thermal_of.c
index 5b76f9a1280d..e86389fa1431 100644
--- a/drivers/thermal/thermal_of.c
+++ b/drivers/thermal/thermal_of.c
@@ -35,7 +35,7 @@  struct __thermal_cooling_bind_param {
 };
 
 /**
- * struct __thermal_bind_param - a match between trip and cooling device
+ * struct __thermal_bind_params - a match between trip and cooling device
  * @tcbp: a pointer to an array of cooling devices
  * @count: number of elements in array
  * @trip_id: the trip point index