| Message ID | 165296424564.4207.5876769207032745575.tip-bot2@tip-bot2 |
|---|---|
| State | New |
| Headers | show |
| Series | [thermal:,thermal/next] thermal/core: Fix memory leak in __thermal_cooling_device_register() | expand |
diff --git a/drivers/thermal/thermal_core.c b/drivers/thermal/thermal_core.c index 82654dc..cdc0552 100644 --- a/drivers/thermal/thermal_core.c +++ b/drivers/thermal/thermal_core.c @@ -947,6 +947,7 @@ __thermal_cooling_device_register(struct device_node *np, return cdev; out_kfree_type: + thermal_cooling_device_destroy_sysfs(cdev); kfree(cdev->type); put_device(&cdev->device); cdev = NULL;
The following commit has been merged into the thermal/next branch of thermal: Commit-ID: 98a160e898c0f4a979af9de3ab48b4b1d42d1dbb Gitweb: https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git//98a160e898c0f4a979af9de3ab48b4b1d42d1dbb Author: Yang Yingliang <yangyingliang@huawei.com> AuthorDate: Wed, 11 May 2022 10:06:05 +08:00 Committer: Daniel Lezcano <daniel.lezcano@linaro.org> CommitterDate: Thu, 19 May 2022 12:11:53 +02:00 thermal/core: Fix memory leak in __thermal_cooling_device_register() I got memory leak as follows when doing fault injection test: unreferenced object 0xffff888010080000 (size 264312): comm "182", pid 102533, jiffies 4296434960 (age 10.100s) hex dump (first 32 bytes): 00 00 00 00 ad 4e ad de ff ff ff ff 00 00 00 00 .....N.......... ff ff ff ff ff ff ff ff 40 7f 1f b9 ff ff ff ff ........@....... backtrace: [<0000000038b2f4fc>] kmalloc_order_trace+0x1d/0x110 mm/slab_common.c:969 [<00000000ebcb8da5>] __kmalloc+0x373/0x420 include/linux/slab.h:510 [<0000000084137f13>] thermal_cooling_device_setup_sysfs+0x15d/0x2d0 include/linux/slab.h:586 [<00000000352b8755>] __thermal_cooling_device_register+0x332/0xa60 drivers/thermal/thermal_core.c:927 [<00000000fb9f331b>] devm_thermal_of_cooling_device_register+0x6b/0xf0 drivers/thermal/thermal_core.c:1041 [<000000009b8012d2>] max6650_probe.cold+0x557/0x6aa drivers/hwmon/max6650.c:211 [<00000000da0b7e04>] i2c_device_probe+0x472/0xac0 drivers/i2c/i2c-core-base.c:561 If device_register() fails, thermal_cooling_device_destroy_sysfs() need be called to free the memory allocated in thermal_cooling_device_setup_sysfs(). Fixes: 8ea229511e06 ("thermal: Add cooling device's statistics in sysfs") Reported-by: Hulk Robot <hulkci@huawei.com> Signed-off-by: Yang Yingliang <yangyingliang@huawei.com> Link: https://lore.kernel.org/r/20220511020605.3096734-1-yangyingliang@huawei.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> --- drivers/thermal/thermal_core.c | 1 + 1 file changed, 1 insertion(+)