| Message ID | 1479544691-59575-18-git-send-email-heyi.guo@linaro.org |
|---|---|
| State | Superseded |
| Headers | show |
On Sat, Nov 19, 2016 at 04:37:32PM +0800, Heyi Guo wrote: > 1. Update SAS binary dirver > 2. Add OemIsNeedDisableExpanderBuffer() interface for SAS driver. > Only add declaration at header file, the actual implementation > code at OemMiscLib. > D02 uses another SAS driver which doesn't need this interface. > > Contributed-under: TianoCore Contribution Agreement 1.0 > Signed-off-by: Heyi Guo <guoheyi@huawei.com> Reviewed-by: Leif Lindholm <leif.lindholm@linaro.org> > --- > Chips/Hisilicon/Include/Library/OemMiscLib.h | 1 + > .../Binary/D03/Drivers/Sas/SasDriverDxe.efi | Bin 233408 -> 210752 bytes > .../D03/Library/OemMiscLib2P/OemMiscLib2PHi1610.c | 5 +++++ > 3 files changed, 6 insertions(+) > > diff --git a/Chips/Hisilicon/Include/Library/OemMiscLib.h b/Chips/Hisilicon/Include/Library/OemMiscLib.h > index 19d92e0..6f18c0f 100644 > --- a/Chips/Hisilicon/Include/Library/OemMiscLib.h > +++ b/Chips/Hisilicon/Include/Library/OemMiscLib.h > @@ -44,6 +44,7 @@ BOOLEAN OemIsMpBoot(); > UINT32 OemIsWarmBoot(); > > VOID OemBiosSwitch(UINT32 Master); > +BOOLEAN OemIsNeedDisableExpanderBuffer(VOID); > > extern EFI_STRING_ID gDimmToDevLocator[MAX_SOCKET][MAX_CHANNEL][MAX_DIMM]; > EFI_HII_HANDLE EFIAPI OemGetPackages (); > diff --git a/Platforms/Hisilicon/Binary/D03/Drivers/Sas/SasDriverDxe.efi b/Platforms/Hisilicon/Binary/D03/Drivers/Sas/SasDriverDxe.efi > index 92f2534..b956b19 100644 > Binary files a/Platforms/Hisilicon/Binary/D03/Drivers/Sas/SasDriverDxe.efi and b/Platforms/Hisilicon/Binary/D03/Drivers/Sas/SasDriverDxe.efi differ > diff --git a/Platforms/Hisilicon/D03/Library/OemMiscLib2P/OemMiscLib2PHi1610.c b/Platforms/Hisilicon/D03/Library/OemMiscLib2P/OemMiscLib2PHi1610.c > index c709f8b..fa1039b 100644 > --- a/Platforms/Hisilicon/D03/Library/OemMiscLib2P/OemMiscLib2PHi1610.c > +++ b/Platforms/Hisilicon/D03/Library/OemMiscLib2P/OemMiscLib2PHi1610.c > @@ -134,3 +134,8 @@ VOID OemBiosSwitch(UINT32 Master) > (VOID)Master; > return; > } > + > +BOOLEAN OemIsNeedDisableExpanderBuffer(VOID) > +{ > + return TRUE; > +} > -- > 1.9.1 >
diff --git a/Chips/Hisilicon/Include/Library/OemMiscLib.h b/Chips/Hisilicon/Include/Library/OemMiscLib.h index 19d92e0..6f18c0f 100644 --- a/Chips/Hisilicon/Include/Library/OemMiscLib.h +++ b/Chips/Hisilicon/Include/Library/OemMiscLib.h @@ -44,6 +44,7 @@ BOOLEAN OemIsMpBoot(); UINT32 OemIsWarmBoot(); VOID OemBiosSwitch(UINT32 Master); +BOOLEAN OemIsNeedDisableExpanderBuffer(VOID); extern EFI_STRING_ID gDimmToDevLocator[MAX_SOCKET][MAX_CHANNEL][MAX_DIMM]; EFI_HII_HANDLE EFIAPI OemGetPackages (); diff --git a/Platforms/Hisilicon/Binary/D03/Drivers/Sas/SasDriverDxe.efi b/Platforms/Hisilicon/Binary/D03/Drivers/Sas/SasDriverDxe.efi index 92f2534..b956b19 100644 Binary files a/Platforms/Hisilicon/Binary/D03/Drivers/Sas/SasDriverDxe.efi and b/Platforms/Hisilicon/Binary/D03/Drivers/Sas/SasDriverDxe.efi differ diff --git a/Platforms/Hisilicon/D03/Library/OemMiscLib2P/OemMiscLib2PHi1610.c b/Platforms/Hisilicon/D03/Library/OemMiscLib2P/OemMiscLib2PHi1610.c index c709f8b..fa1039b 100644 --- a/Platforms/Hisilicon/D03/Library/OemMiscLib2P/OemMiscLib2PHi1610.c +++ b/Platforms/Hisilicon/D03/Library/OemMiscLib2P/OemMiscLib2PHi1610.c @@ -134,3 +134,8 @@ VOID OemBiosSwitch(UINT32 Master) (VOID)Master; return; } + +BOOLEAN OemIsNeedDisableExpanderBuffer(VOID) +{ + return TRUE; +}
1. Update SAS binary dirver 2. Add OemIsNeedDisableExpanderBuffer() interface for SAS driver. Only add declaration at header file, the actual implementation code at OemMiscLib. D02 uses another SAS driver which doesn't need this interface. Contributed-under: TianoCore Contribution Agreement 1.0 Signed-off-by: Heyi Guo <guoheyi@huawei.com> --- Chips/Hisilicon/Include/Library/OemMiscLib.h | 1 + .../Binary/D03/Drivers/Sas/SasDriverDxe.efi | Bin 233408 -> 210752 bytes .../D03/Library/OemMiscLib2P/OemMiscLib2PHi1610.c | 5 +++++ 3 files changed, 6 insertions(+)