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[v3,0/6] thermal: qcom: tsens: Fix MDM9607, add MSM8909

Message ID 20230315103950.2679317-1-stephan.gerhold@kernkonzept.com
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Series thermal: qcom: tsens: Fix MDM9607, add MSM8909 | expand

Message

Stephan Gerhold March 15, 2023, 10:39 a.m. UTC 
Make the MDM9607 thermal sensor support consistent with Qualcomm's
vendor kernel (msm-3.18) by applying the correct default slope values
and adding "correction factors" to the factory calibration values in the
fuses. Use the same functionality to add the very similar MSM8909 SoC to
the tsens driver.

---
Changes in v3: Drop now unused definition reported by kernel test robot
Changes in v2:
  - Rewrite on top of per-sensor nvmem cell changes that landed in 6.3
  - Add patches to fix existing support for MDM9607

Stephan Gerhold (6):
  thermal: qcom: tsens: Drop unused legacy structs
  thermal: qcom: tsens-v0_1: Fix mdm9607 slope values
  thermal: qcom: tsens-v0_1: Add mdm9607 correction offsets
  dt-bindings: thermal: qcom-tsens: Drop redundant compatibles
  dt-bindings: thermal: qcom-tsens: Add MSM8909 compatible
  thermal: qcom: tsens-v0_1: Add MSM8909 data

 .../bindings/thermal/qcom-tsens.yaml          | 23 +----
 drivers/thermal/qcom/tsens-v0_1.c             | 95 +++++++++++--------
 drivers/thermal/qcom/tsens-v1.c               | 22 -----
 drivers/thermal/qcom/tsens.c                  | 19 +++-
 drivers/thermal/qcom/tsens.h                  |  6 +-
 5 files changed, 80 insertions(+), 85 deletions(-)