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[2.99.112.229]) by smtp.gmail.com with ESMTPSA id x15-20020adfcc0f000000b0032330e43590sm10226848wrh.22.2023.09.29.09.16.46 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Fri, 29 Sep 2023 09:16:47 -0700 (PDT) From: Caleb Connolly Subject: [PATCH 0/4] thermal: Introduce Qualcomm Thermal Mitigation Device support Date: Fri, 29 Sep 2023 17:16:16 +0100 Message-Id: <20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@linaro.org> MIME-Version: 1.0 X-B4-Tracking: v=1; b=H4sIAFD4FmUC/x2N0QqDMAwAf0XyvLK2Q8X9yhgjzTINaOvSKQPx3 1f3eBzHbZBZhTNcqw2UV8mSYgF3qoAGjD0beRYGb/3FdrY2hCMH857kQSmNEntTN65pkbo2OA+ lC5jZBMVIw1Eu83nC/GE93Kz8ku//d7vv+w9mbY5tfwAAAA== To: Andy Gross , Bhupesh Sharma , Bjorn Andersson , Konrad Dybcio , Mathieu Poirier , Rob Herring , Krzysztof Kozlowski , Conor Dooley , "Rafael J. Wysocki" , Daniel Lezcano , Amit Kucheria , Zhang Rui , Sibi Sankar , Manivannan Sadhasivam , Thara Gopinath Cc: linux-arm-msm@vger.kernel.org, linux-remoteproc@vger.kernel.org, devicetree@vger.kernel.org, linux-pm@vger.kernel.org, Caleb Connolly X-Mailer: b4 0.13-dev-46309 X-Developer-Signature: v=1; a=openpgp-sha256; l=1836; i=caleb.connolly@linaro.org; h=from:subject:message-id; bh=VEPqvD4CC9Ro8CIyvLwYQ44Yqd1l9r+l5d1hnsJWdDY=; b=owGbwMvMwCFYaeA6f6eBkTjjabUkhlSxH3klzcXeAlrxp/SMEmubHvy+v/Pz6aIZZnN/z4yqb XgWwRTTUcrCIMjBICumyCJ+Ypll09rL9hrbF1yAmcPKBDKEgYtTACYy9yvD/4JJz5Q/nWj62xgR 9/veg2NzQgtiTpUePXFx0n2llyb7r29g+J8llnla/JdiqdPm+b+vziv6oz+D5/ieSTuev+lQn/B Rfl49AA== X-Developer-Key: i=caleb.connolly@linaro.org; a=openpgp; fpr=83B24DA7FE145076BC38BB250CD904EB673A7C47 Precedence: bulk List-ID: X-Mailing-List: linux-pm@vger.kernel.org The Thermal Mitigation Device (TMD) Service is a QMI service that runs on remote subsystems (the modem and DSPs) on Qualcomm SoCs. It exposes various mitigations including passive thermal controls and rail voltage restrictions. This series introduces support for exposing TMDs as cooling devices in the kernel through the thermal framework, using the QMI interface. Each TMD client is described as a child of the remoteproc node in devicetree. With subnodes for each control. This series is based on previous work by Bhupesh Sharma which can be found at [1]. I'm sending this as a fresh series as it has been a year since the original version and I have rewritten most of the driver. [1]: https://lore.kernel.org/linux-arm-msm/20220912085049.3517140-1-bhupesh.sharma@linaro.org/ --- Caleb Connolly (4): remoteproc: qcom: probe all child devices dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings thermal: qcom: add qmi-cooling driver MAINTAINERS: Add entry for Qualcomm Cooling Driver .../bindings/remoteproc/qcom,msm8996-mss-pil.yaml | 13 + .../bindings/remoteproc/qcom,pas-common.yaml | 6 + .../bindings/thermal/qcom,qmi-cooling.yaml | 168 +++++++ MAINTAINERS | 8 + drivers/remoteproc/qcom_q6v5.c | 4 + drivers/remoteproc/qcom_q6v5_mss.c | 8 - drivers/thermal/qcom/Kconfig | 13 + drivers/thermal/qcom/Makefile | 1 + drivers/thermal/qcom/qmi-cooling.c | 520 +++++++++++++++++++++ drivers/thermal/qcom/qmi-cooling.h | 428 +++++++++++++++++ 10 files changed, 1161 insertions(+), 8 deletions(-) --- base-commit: 9067f80db58bbce81d5f0703aa2fd261e88bc812 // Caleb (they/them)